Tier-N supply-chain visibility
Electronics supply chains are the most fragmented of any regulated sector, with a typical smartphone containing components from more than 200 suppliers across 40 countries. The DPP requires manufacturers to capture supplier-level data deep into the value chain: semiconductor foundry and assembly-test vendor for each integrated circuit, PCB fabricator and laminate supplier, surface-mount and through-hole assembly partner, plastics moulder and resin supplier, packaging converter and ink chemistry. The realistic data-collection model is tiered: full disclosure for tier-1 (direct contractual), aggregate disclosure for tier-2, and risk-flagged sampling for tier-3 and beyond, with conflict-mineral 3TG due diligence (Regulation 2017/821) as the floor. Trade-secret protection is the most contentious topic in industry consultations: the ESPR delegated acts will permit a tiered access model where commercially sensitive fields are exposed only to designated authorities, while public users see aggregated or qualitative information.
Tiered disclosure with cryptographic binding in the DPP, 3TG due diligence (Regulation 2017/821) as floor, contractual Tier-2/3 data obligation.

